UPDS1045
Overview
- Guard ring die construction for transient protection Low power loss, high efficiency Low forward voltage drop Low reverse leakage current High junction temperature capability High forward surge current capability Environmentally friendly molding compound (no Br, Sb) Low inductive parasitics for minimal Ldi/dt effects Lead-Free Finish & RoHS Compliant per EU Directive Rev 13.2.2003 (glass and high temperature solder exemptions per Annex Notes 5 and 7 therein)
